2002/95/EC的附錄中增加33-38項(xiàng)：
33.直徑100微米的細(xì)銅線和小于直徑100微米的電力變壓器的焊料中的鉛。
Lead in solders for the soldering of thin copper wires of 100μm diameter and less in power transformers.
34.金屬陶瓷質(zhì)的微調(diào)電位器中的鉛含量。
Lead in cermet-based trimmer potentiometer elements.
35.2009年12月31日前專(zhuān)業(yè)音頻
Cadmium in photoresistors for optocouplers applied in professional audio equipment until 31 December 2009.
36．2010年7月1日前直流等離子顯示器中，作為陰極濺射抑制劑中的汞在第個(gè)顯示器中的含量不得超過(guò)30毫克。
Mercury used as a cathode sputtering inhibitor in DC plasma displays with a content up to 30 mg per display until 1 July 2010.
37.以硼酸鋅玻璃體為基礎(chǔ)的高壓二極管的電鍍層的鉛含量。
Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body
38.用氧化鈹連接鋁制成的厚膜漿料中鎘和氧化鎘的含量
Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide.
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